Fortunately Alex my BCs are scratching the 400s HFE so I will give it a shot with those. Sourcing transistors it´s been a pain for me. It is sad that the local stock is so poor around here...fruits of living in a small city in this falling to pieces country.
Anyways, enough rant for now, the good news is that I´m 99% done, I mean it is finished but maybe I´ll change a few things here and there. I want to try different input caps, output resistors and so on, but for that I need to let it "marinate" and test drive it first and then jump to "improve" the SQ to my liking and to my phones.
During the building tests I had installed the original BB IC but now I have installed the LME49720HA, I let it burn for a couple of hours and it does get pretty warm so I will put some kind of heat-sink as many of you guys have done, unfortunately I can find the adequate heat-sink for it, so I´ll improvise (again) and adapt something to it to dissipate the heat, maybe paste a squared heat-sink to the top? what type of glue do you recommend for this?.
Hi Rob You may be able to fashion some kind of " wing" from a small piece of tin plate or similar.(Milo tin lid etc.) Although it feels quite warm, it is exactly the same chip inside as the plastic DIP 8 version, and doesn't really need a heatsink. It's just better thermal management due to the metal can.